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S.J KIM 工程师
2021-01-06 11:50:06
-现任玖芯半导体有限公司工程师
-ITM 半导体: Assembly process eng’r
-Wafer Bumping: SMIC 40n, SEC 28/40n, TSMC 40n Bumping technology (BOP, Repassivation, RDL)
-Bumping site survey and RFQ, management for development.
-Total Process Control (Silicon out-Bumping-packaging (FCBGA with Hybrid)
-ITM 半导体: Assembly process eng’r
-Wafer Bumping: SMIC 40n, SEC 28/40n, TSMC 40n Bumping technology (BOP, Repassivation, RDL)
-Bumping site survey and RFQ, management for development.
-Total Process Control (Silicon out-Bumping-packaging (FCBGA with Hybrid)
