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U.S SHIN 工程师
2021-01-06 11:50:07
-现任玖芯半导体有限公司工程师
-AMKOR KOREA: Assembly process eng’r FCBGA, WLCSP, Wafer Bumping, QFN PART
-QFN, BGA(Flipchip, Wire bonding, Hybrid),SIP for each applications FCBGA with Hybrid(Main Package for production),CUF & MUF consideration with bump pitch
-AMKOR KOREA: Assembly process eng’r FCBGA, WLCSP, Wafer Bumping, QFN PART
-QFN, BGA(Flipchip, Wire bonding, Hybrid),SIP for each applications FCBGA with Hybrid(Main Package for production),CUF & MUF consideration with bump pitch
